Towards a Fully Integrated 4H-SiC A-Plane Quantum-Chip – Transistors and Light Emitters (2026) Schwarberg J, Dick J, May A, Michałowski P, Kallinger B, Kammel R, Rommel M, Schulze J Journal article Scalable Fabrication and Electrical Characterization of Lateral pin-Diodes on 4H-SiC a-Plane Wafers for Functionalization of Silicon Vacancies (2026) Schwarberg J, Gobert C, Hrunski F, May A, Knolle W, Kallinger B, Schmid F, et al. Journal article Device Modeling of 4H-SiC PIN Photodiodes with Shallow Implanted Al Emitters for VUV Sensor Applications (2024) Schraml M, Rommel M, Papathanasiou N, Erlbacher T Journal article Towards SiC-Based VUV Pin-Photodiodes - Investigations on 4H-SiC Photodiodes with Shallow Implanted Al Emitters (2023) Schraml M, Papathanasiou N, May A, Weiss T, Erlbacher T Book chapter / Article in edited volumes Drawing Capability of High Formable Packaging Steel: Comparison of Limiting Drawing Ratio and Forming Limit Curve (2022) Knieps F, Köhl M, Merklein M Conference contribution Characterization and Modelling of Sheet Material with Graded Strength for More Accurate Finite Element Analysis (2022) Lenzen M, Kraus M, Merklein M Conference contribution Investigation of the Influence by Size Effects on the Material Characterization of the Uniaxial Compression Stress State (2022) Hetz P, Kraus M, Merklein M Conference contribution Analysis of the Part Quality and Process Stability when Producing Metallic Micro Parts by Multi-Stage Bulk Forming from Sheet Metal (2022) Kraus M, Merklein M Conference contribution Friction Characterisation for a Tumbling Self-Piercing Riveting Process (2021) Wituschek S, Lechner M Journal article, Original article Local strain measurement in tensile test for an optimized characterization of packaging steel for finite element analysis (2021) Knieps F, Köhl M, Merklein M Conference contribution