Device Modeling of 4H-SiC PIN Photodiodes with Shallow Implanted Al Emitters for VUV Sensor Applications

Schraml M, Rommel M, Papathanasiou N, Erlbacher T

Publication Type: Journal article

Journal

Key Engineering Materials Trans Tech Publications

Publisher: Trans Tech Publications Ltd

Series: Key Engineering Materials

Book Volume: 984

Pages Range: 55-62

DOI: 10.4028/p-T0xLa9

Abstract

A numerical model is presented for the simulation of ultraviolet ion-implanted 4H-SiC photodiodes with shallow p- emitter doping profiles. An existing model for SiC pin photodiodes, taken from literature, is modified with a dedicated SiO2-SiC interface layer to account for degradation of carrier mobility and lifetime at the interface. Furthermore, aluminum compensation in 4H-SiC is included and its impact on the spectral response and carrier recombination is analyzed. The simulated spectral response in the wavelength range from 200 to 400 nm is compared to experimental data. While the existing model, taken from literature, fails to predict the performance of VUV photodiodes with a shallow p- emitter, the newly designed model successfully achieves high accuracy, even with a basic modeling approach featuring an abrupt material parameter transition.

Authors with CRIS profile

Tobias Erlbacher Lehrstuhl für Elektronische Bauelemente

Involved external institutions

Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB) DE Germany (DE) sglux GmbH DE Germany (DE)

How to cite

APA:

Schraml, M., Rommel, M., Papathanasiou, N., & Erlbacher, T. (2024). Device Modeling of 4H-SiC PIN Photodiodes with Shallow Implanted Al Emitters for VUV Sensor Applications. Key Engineering Materials, 984, 55-62. https://doi.org/10.4028/p-T0xLa9

MLA:

Schraml, Michael, et al. "Device Modeling of 4H-SiC PIN Photodiodes with Shallow Implanted Al Emitters for VUV Sensor Applications." Key Engineering Materials 984 (2024): 55-62.

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