Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB)

Research facility


Location: Erlangen, Germany (DE) DE

ISNI: 0000000104810543

ROR: https://ror.org/04q5rka56

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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

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Abstract

Journal

Capillary-assisted automated silver direct bond of chip-on-chip through a novel sponge-dipping approach (2026) Weber J, Rauh H, März M Journal article On the Implementation of Burst Mode in Modular Active Cell Controlled Energy Routers (2026) Schwanninger R, Lindner M, Yang X, Stöcklein N, März M Conference contribution Implementation of Modular Active Cell (MAC) Control on Multi-Port Home Energy Routers (2026) Yang X, Stöcklein N, Schwanninger R, Wunder B, Lorentz V, März M Conference contribution Low-Temperature Characterization of Sheet and Contact Resistance in 4H-SiC Test Structures from 300 K to 4 K (2026) Hobbacher E, Magerl F, Pixius C, Förthner J, May A, Rommel M, Schulze J Conference contribution Impact of Surface Treatment on Noise in PL Measurements of Silicon Vacancies in 4H-SiC Lateral PIN-Diodes (2026) Schwarberg J, Magerl F, Beuer S, May A, Gobert C, Siebert M, Miersch C, et al. Journal article, Letter Correction: Direct investigation of localized leakage currents in GaN-on-sapphire pn-diodes (Scientific Reports, (2025), 15, 1, (39578), 10.1038/s41598-025-25338-0) (2026) Kinstler A, Neumann R, Taylor AA, Besendörfer S, Meißner E, Weingärtner R, Brunner F, et al. Journal article, Erratum Towards a Fully Integrated 4H-SiC A-Plane Quantum-Chip – Transistors and Light Emitters (2026) Schwarberg J, Dick J, May A, Michałowski P, Kallinger B, Kammel R, Rommel M, Schulze J Journal article Switching Performance and Loss Analysis of SiC/Si-Hybrid Sparse NPC Inverters (2026) Quergfelder S, Sax J, Heckel T, Menrath T, Eckardt B, März M Conference contribution Hardware-based electric drive train fault detection unit enabling fail-operational capabilities for aviation applications (2026) Kuhn L, Meindl M, Bentheimer C, März M Journal article Scalable Fabrication and Electrical Characterization of Lateral pin-Diodes on 4H-SiC a-Plane Wafers for Functionalization of Silicon Vacancies (2026) Schwarberg J, Gobert C, Hrunski F, May A, Knolle W, Kallinger B, Schmid F, et al. Journal article
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