Bettina Macher

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Lehrstuhl für Leistungselektronik (LEE)

Cold Atmospheric Plasma Metallization of Power Semiconductor Bare Dies with CuSn Pseudo-Alloys for Diffusion Soldering (2024) Ockel M, Gökçen A, Ottinger B, Petersen M, Voigt C, Franke J Conference contribution, Conference Contribution Investigations Selected Influencing of Process Factors for Transient Liquid Phase Soldering (TLPS) as a Die-attach Method for Automotive Power Modules (2024) Ottinger B, Holverscheid J, König S, Brunner A, Müller L, Goth C, Franke J Journal article Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation (2023) Ottinger B, Mathew A, König S, Albrecht J, Sprenger M, Müller L, Goth C, Franke J Journal article Investigations of selected influencing process factors for transient liquid phase soldering (TLPS) as die-attach method for automotive power modules (2023) Ottinger B, Holverscheid J, König S, Brunner A, Müller L, Goth C, Franke J Conference contribution, Conference Contribution Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications (2023) Alzoubi K, Hensel A, Häußler F, Ottinger B, Sippel M, Franke J Journal article Warpage of transfer-molded automotive power modules - experimental characterization, numerical simulation and optimization (2023) Sprenger M, Kramer M, Tolyschew E, Steinau M, Renner D, Ottinger B, Franke J Conference contribution Location dependent down-rating of voids in high power solder connections for automotive power modules (2022) Ottinger B, Murk S, König S, Zangarro A, Müllmaier M, Müller L, Franke J Conference contribution, Conference Contribution Location dependent down-rating of voids in high power solder connections for automotive power modules (2022) Ottinger B, Murk S, König S, Zangarro A, Müllmaier M, Müller L, Franke J Conference contribution Reliability assessment and thermal characterization of automotive power module package based on novel thick copper-ceramic substrate and hard epoxy encapsulation (2022) Sprenger M, Forndran F, Ottinger B, Braun T, Franke J Conference contribution, Conference Contribution Reliability of lead-free solders for die attach in automotive power modules (2022) Ottinger B, Holverscheid J, Konig S, Jerichow E, Lunz S, Sprenger M, Muller L, et al. Conference contribution