Warpage of transfer-molded automotive power modules - experimental characterization, numerical simulation and optimization

Sprenger M, Kramer M, Tolyschew E, Steinau M, Renner D, Ottinger B, Franke J (2023)

Publication Type: Conference contribution

Publication year: 2023

Publisher: Institute of Electrical and Electronics Engineers Inc.

Conference Proceedings Title: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

Event location: Graz AT

ISBN: 9798350345971

DOI: 10.1109/EuroSimE56861.2023.10100795

Abstract

Warpage behaviour of a transfer-molded power module package has been studied experimentally and numerically throughout the assembly flow. Warpage in different assembly states ((1) bare metal-ceramic substrates, (2) substrates attached to copper leadframe, (3) transfer-molded package) has been assessed and influences of variations of substrate backside structure and epoxy mold compound type onto the warpage evaluated. The numerical modeling framework build-up has been validated within this study and does allow for rapid warpage prediction based on package geometry and manufacturing process temperatures.

Authors with CRIS profile

Mario Sprenger Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Bettina Ottinger Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

Involved external institutions

Vitesco Technologies GmbH DE Germany (DE)

How to cite

APA:

Sprenger, M., Kramer, M., Tolyschew, E., Steinau, M., Renner, D., Ottinger, B., & Franke, J. (2023). Warpage of transfer-molded automotive power modules - experimental characterization, numerical simulation and optimization. In 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Graz, AT: Institute of Electrical and Electronics Engineers Inc..

MLA:

Sprenger, Mario, et al. "Warpage of transfer-molded automotive power modules - experimental characterization, numerical simulation and optimization." Proceedings of the 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Graz Institute of Electrical and Electronics Engineers Inc., 2023.

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