Vitesco Technologies GmbH

Industry / private company


Location: Nürnberg, Roding, Regensburg, Germany (DE) DE


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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

From
To

Abstract

Journal

Investigations on spatial beam oscillation using a high-power blue laser (2026) Plutz L, Bartels D, Hölbling C, Jaskowiak C, Goth C, Schmidt M Journal article Sustainable future of the automobile industry: enhancing supply chain resilience (2026) Gautam A, Akhtar A, Shah M, Gautam U Journal article Wavelength-dependent Process Stability in Laser Micro Welding of Copper with High Thickness Ratios (2026) Plutz L, Bartels D, Hölbling C, Jaskowiak C, Goth C, Schmidt M Journal article, Original article Empirical analysis, mapping and prioritisation of supply chain risk - Indian automotive context (2025) Gautam A, Akhtar A, Shah M, Gautam U Journal article HyFAR: A hypervisor-based fault tolerance approach for heterogeneous automotive real-time systems (2024) Lex J, Margull U, Mader R, Fey D Journal article Comparison of the Young's modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and β-Sn single crystal calculations (2024) Ernst B, Kubaschinski P, Schiessl A, Waltz M, Höppel HW, Tetzlaff U Journal article Influence of material thickness and hatching strategies on laser cutting of epoxy mold composites (2024) Kohl J, Will T, Klier T, Müller L, Goth C Journal article Modelling Warpage Behavior of Molded Power Modules for Electric Vehicles (2024) Forndran F, Sprenger M, Barrera JR, Steinau M, Roellig M, Muench S Conference contribution Influence of hard encapsulation onto reliability of soldered die-attach in power modules (2024) Sprenger M, Forndran F, Öztürk B, Sippel M, Ockel M, Goth C, Franke J Conference contribution Investigations Selected Influencing of Process Factors for Transient Liquid Phase Soldering (TLPS) as a Die-attach Method for Automotive Power Modules (2024) Ottinger B, Holverscheid J, König S, Brunner A, Müller L, Goth C, Franke J Journal article
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