Vitesco Technologies GmbH

Comparison of the Young's modulus of the lead free solder alloy Sn-Ag3.8-Cu0.7 determined by hot tensile tests, ultrasonic measurements and β-Sn single crystal calculations (2024) Ernst B, Kubaschinski P, Schiessl A, Waltz M, Höppel HW, Tetzlaff U Journal article Influence of material thickness and hatching strategies on laser cutting of epoxy mold composites (2024) Kohl J, Will T, Klier T, Müller L, Goth C Journal article Influence of hard encapsulation onto reliability of soldered die-attach in power modules (2024) Sprenger M, Forndran F, Öztürk B, Sippel M, Ockel M, Goth C, Franke J Conference contribution Investigations Selected Influencing of Process Factors for Transient Liquid Phase Soldering (TLPS) as a Die-attach Method for Automotive Power Modules (2024) Ottinger B, Holverscheid J, König S, Brunner A, Müller L, Goth C, Franke J Journal article Modelling Warpage Behavior of Molded Power Modules for Electric Vehicles (2024) Forndran F, Sprenger M, Barrera JR, Steinau M, Roellig M, Muench S Conference contribution Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation (2023) Ottinger B, Mathew A, König S, Albrecht J, Sprenger M, Müller L, Goth C, Franke J Journal article Laser welding of different pure copper materials under consideration of shielding gas influence and impact on quality relevant surface topographical features (2023) Will T, Kohl J, Hoelbling C, Mueller L, Schmidt M Journal article Warpage of transfer-molded automotive power modules - experimental characterization, numerical simulation and optimization (2023) Sprenger M, Kramer M, Tolyschew E, Steinau M, Renner D, Ottinger B, Franke J Conference contribution Prediction of electrical resistance of laser-welded copper pin-pairs with surface topographical information from inline post-process observation by optical coherence tomography (2023) Will T, Müller J, Müller R, Hölbling C, Goth C, Schmidt M Journal article Evaluation of different hypervisor technologies for real-time sensitive backup strategies in heterogeneous systems (2023) Lex J, Margull U, Fey D, Mader R Conference contribution