Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation

Ottinger B, Mathew A, König S, Albrecht J, Sprenger M, Müller L, Goth C, Franke J (2023)

Publication Type: Journal article

Publication year: 2023

Journal

Microelectronics Reliability Elsevier

Article Number: 115097

DOI: 10.1016/j.microrel.2023.115097

Abstract

The demand for reliable, lead-free and high temperature stable solder interconnects for power electronic application has increased in recent years. The die attach solder materials are exposed to higher electrical currents and temperatures due to advancing designs and wide band-gap semiconductors. The diffusion soldering material Sn-Cu-Sn with its high post processing melting temperature is a promising option for high temperature die attach interconnects. The aim of this work is to predict potential failure mechanisms in the die attach of automotive power modules due to simulation based thermo-mechanical analysis of the diffusion solder Sn-Cu-Sn layer and SAC. The FE-model is validated with experimental results from active power cycling tests. The simulation indicates a potential for lifetime increase by usage of layered diffusion solder. The created FE-simulation model could be used for simulation-based design for reliability to reduce material costs and development time.

Authors with CRIS profile

Bettina Ottinger Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

Involved external institutions

Fraunhofer-Institut für Elektronische Nanosysteme ENAS / Fraunhofer Institute for Electronic Nano Systems DE Germany (DE) Vitesco Technologies GmbH DE Germany (DE)

How to cite

APA:

Ottinger, B., Mathew, A., König, S., Albrecht, J., Sprenger, M., Müller, L.,... Franke, J. (2023). Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation. Microelectronics Reliability. https://dx.doi.org/10.1016/j.microrel.2023.115097

MLA:

Ottinger, Bettina, et al. "Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation." Microelectronics Reliability (2023).

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