Bettina Macher

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Lehrstuhl für Leistungselektronik (LEE)

Cold Atmospheric Plasma Metallization of Power Semiconductor Bare Dies with CuSn Pseudo-Alloys for Diffusion Soldering (2024) Ockel M, Gökçen A, Ottinger B, Petersen M, Voigt C, Franke J Conference contribution, Conference Contribution Investigations Selected Influencing of Process Factors for Transient Liquid Phase Soldering (TLPS) as a Die-attach Method for Automotive Power Modules (2024) Ottinger B, Holverscheid J, König S, Brunner A, Müller L, Goth C, Franke J Journal article Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation (2023) Ottinger B, Mathew A, König S, Albrecht J, Sprenger M, Müller L, Goth C, Franke J Journal article Investigations of selected influencing process factors for transient liquid phase soldering (TLPS) as die-attach method for automotive power modules (2023) Ottinger B, Holverscheid J, König S, Brunner A, Müller L, Goth C, Franke J Conference contribution, Conference Contribution Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications (2023) Alzoubi K, Hensel A, Häußler F, Ottinger B, Sippel M, Franke J Journal article Warpage of transfer-molded automotive power modules - experimental characterization, numerical simulation and optimization (2023) Sprenger M, Kramer M, Tolyschew E, Steinau M, Renner D, Ottinger B, Franke J Conference contribution Location dependent down-rating of voids in high power solder connections for automotive power modules (2022) Ottinger B, Murk S, König S, Zangarro A, Müllmaier M, Müller L, Franke J Conference contribution, Conference Contribution Reliability assessment and thermal characterization of automotive power module package based on novel thick copper-ceramic substrate and hard epoxy encapsulation (2022) Sprenger M, Forndran F, Ottinger B, Braun T, Franke J Conference contribution, Conference Contribution Reliability of lead-free solders for die attach in automotive power modules (2022) Ottinger B, Holverscheid J, Konig S, Jerichow E, Lunz S, Sprenger M, Muller L, et al. Conference contribution Hard encapsulation of automotive power modules by epoxy potting-encapsulant selection assisted by thermo-mechanical simulation (2022) Sprenger M, Forndran F, Ottinger B, Dammann T, Erben B, Sippel M, Franke J Conference contribution