Manuela Ockel

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

Laser-Based Powder Bed Fusion of Copper Powder on Aluminum Nitride Ceramics for Power Electronic Applications (2025) Utsch D, Turowski T, Hecht C, Thielen N, Ockel M, Franke J, Risch F Journal article Optimizing Thin Electric Functional Copper Coatings via Atmospheric Plasma Spray: Impact of Particle Temperature and Velocity (2025) Gökçen A, Ockel M, Petersen M, Thielen N, Franke J, Risch F Conference contribution Influence of Hydrogen-Enhanced Annealing on the Morphology of Atmospheric Plasma Sprayed Copper (2025) Ockel M, Albrecht I, Gökçen A, Thielen N, Franke J, Risch F Conference contribution Evaluation of the Cold Atmospheric Plasma Metallization of Bare Dies with Copper Through Life Cycle Assessment (2024) Ockel M, Funk F, Janisch L, Franke J Book chapter / Article in edited volumes Atmospheric Plasma Spraying for Copper Coating of Ceramic Solid Electrolytes for Anode-Free Solid-State Batteries with Increased Interfacial Contact (2024) Ockel M, Borchers A, Fröhlich J, Petersen M, Paschen T, Christiansen S, Franke J Conference contribution, Conference Contribution Implementation of a Camera System for the Application of Artificial Intelligence in Monitoring the Cold Atmospheric Plasma Spray Process (2024) Ockel M, Meier S, Stelter O, Thielen N, Bründl P, Franke J Conference contribution Cold Atmospheric Plasma Metallization of Power Semiconductor Bare Dies with CuSn Pseudo-Alloys for Diffusion Soldering (2024) Ockel M, Gökçen A, Ottinger B, Petersen M, Voigt C, Franke J Conference contribution, Conference Contribution Influence of hard encapsulation onto reliability of soldered die-attach in power modules (2024) Sprenger M, Forndran F, Öztürk B, Sippel M, Ockel M, Goth C, Franke J Conference contribution Fabrication of metal-ceramic substrates by laser powder bed fusion using a high-power green laser and high temperature preheating (2024) Hecht C, Ockel M, Stoll T, Franke J Conference contribution, Conference Contribution A Conceptional Study towards Developing a Novel Copper Top-Side Interconnection Process in Power Electronics using Additive Manufacturing (2023) Ockel M, Sippel M, Hecht C, Janisch L, Franke J Conference contribution, Conference Contribution