Manuela Ockel

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

Effect of Plasma Gas onto Epoxy Mold Compound Adhesion within Heatsink Attach of Power Modules (2025) Sprenger M, Fegus M, Ockel M, Hechtel M, Goth C, Franke J, Risch F Conference contribution Laser-Based Powder Bed Fusion of Copper Powder on Aluminum Nitride Ceramics for Power Electronic Applications (2025) Utsch D, Turowski T, Hecht C, Thielen N, Ockel M, Franke J, Risch F Journal article Optimizing Thin Electric Functional Copper Coatings via Atmospheric Plasma Spray: Impact of Particle Temperature and Velocity (2025) Gökçen A, Ockel M, Petersen M, Thielen N, Franke J, Risch F Conference contribution Influence of Hydrogen-Enhanced Annealing on the Morphology of Atmospheric Plasma Sprayed Copper (2025) Ockel M, Albrecht I, Gökçen A, Thielen N, Franke J, Risch F Conference contribution Evaluation of the Cold Atmospheric Plasma Metallization of Bare Dies with Copper Through Life Cycle Assessment (2024) Ockel M, Funk F, Janisch L, Franke J Book chapter / Article in edited volumes Atmospheric Plasma Spraying for Copper Coating of Ceramic Solid Electrolytes for Anode-Free Solid-State Batteries with Increased Interfacial Contact (2024) Ockel M, Borchers A, Fröhlich J, Petersen M, Paschen T, Christiansen S, Franke J Conference contribution, Conference Contribution Implementation of a Camera System for the Application of Artificial Intelligence in Monitoring the Cold Atmospheric Plasma Spray Process (2024) Ockel M, Meier S, Stelter O, Thielen N, Bründl P, Franke J Conference contribution Cold Atmospheric Plasma Metallization of Power Semiconductor Bare Dies with CuSn Pseudo-Alloys for Diffusion Soldering (2024) Ockel M, Gökçen A, Ottinger B, Petersen M, Voigt C, Franke J Conference contribution, Conference Contribution Influence of hard encapsulation onto reliability of soldered die-attach in power modules (2024) Sprenger M, Forndran F, Öztürk B, Sippel M, Ockel M, Goth C, Franke J Conference contribution Fabrication of metal-ceramic substrates by laser powder bed fusion using a high-power green laser and high temperature preheating (2024) Hecht C, Ockel M, Stoll T, Franke J Conference contribution, Conference Contribution