Towards a multi-agent-based diagnostic system for prescriptive maintenance applications in industrial environments

Mahr F, Kratzke C, Franke J, Ockel M (2026)

Publication Type: Conference contribution

Publication year: 2026

Publisher: Institute of Electrical and Electronics Engineers Inc.

Pages Range: 359-360

Conference Proceedings Title: 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS 2026

Event location: Hiroshima JP

ISBN: 9784991483516

DOI: 10.23919/ICEP-HBS69241.2026.11550601

Abstract

Unplanned downtime in Surface-Mount Technology (SMT) production represents a critical bottleneck for achieving high Overall Equipment Effectiveness (OEE). While Predictive Maintenance systems detect trend anomalies, they lack the transition to actionable Prescriptive Maintenance with multi-dimensional instructions. This paper introduces the architecture of a prescriptive maintenance system built upon a Multi-Agent System (MAS) leveraging Large Language Models (LLMs). The system generates context-aware maintenance recommendations in real-time, even from uncertain anomaly data, transforming one-dimensional predictions into human-centric instructions.

Authors with CRIS profile

Felix Mahr Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Manuela Ockel Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

How to cite

APA:

Mahr, F., Kratzke, C., Franke, J., & Ockel, M. (2026). Towards a multi-agent-based diagnostic system for prescriptive maintenance applications in industrial environments. In 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS 2026 (pp. 359-360). Hiroshima, JP: Institute of Electrical and Electronics Engineers Inc..

MLA:

Mahr, Felix, et al. "Towards a multi-agent-based diagnostic system for prescriptive maintenance applications in industrial environments." Proceedings of the 25th International Conference on Electronics Packaging, held in conjunction with the IEEE EPS Hybrid Bonding Symposium, ICEP-HBS2026, Hiroshima Institute of Electrical and Electronics Engineers Inc., 2026. 359-360.

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