Dr.-Ing. Manuela Ockel



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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

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Abstract

Journal

STEER-FL: A process model for federated learning derived from a dual-perspective systematic literature review (2026) Rachinger B, Meier S, Franke J, Ockel M Journal article Optimization potential in the production and end-of-life-management of electric drive units to increase resource efficiency (2026) Ihne T, Vogel A, Ockel M, Sprenger M, Hahn R, Baader M, Thielen N, et al. Conference contribution Fabrication of Thin Copper Anode Current Collectors on Ceramic Solid Electrolytes Using Atmospheric Plasma Spraying for Anode-Free Solid-State Batteries (2026) Borchers A, Paschen T, Ockel M, Vollnhals F, Dirksen C, Muckelbauer M, Uzakbaiuly B, et al. Journal article Near-Chip 3D Functionalization of Direct Copper Bonded Substrates in Power Electronic Modules (2026) Hecht C, Wiegand D, Sippel M, Franke J, Ockel M Conference contribution Intelligent Troubleshooting System for SMT Manufacturing Using Web Scraping, GraphRAG and Knowledge Graphs (2026) Mahr F, Franke J, Ockel M Conference contribution Atmosphärisches Plasmaspritzen zur Kupfermetallisierung leistungselektronischer Halbleiterbauelemente (2026) Ockel M Thesis Enhancing Functional Properties of Thin, Atmospheric Plasma-Sprayed Cu Coatings: A Comparative Study of Furnace and Laser Annealing (2026) Gökçen A, Schickel J, Franke J, Ockel M Conference contribution, Conference Contribution Aeroacoustic Free-Field Microphony for Process Stability and Nozzle Clogging Detection in Atmospheric Plasma Spray (2026) Ockel M, Dötsch C, Hanf T, Franke J Conference contribution, Conference Contribution Effect of Plasma Gas onto Epoxy Mold Compound Adhesion within Heatsink Attach of Power Modules (2025) Sprenger M, Fegus M, Ockel M, Hecht C, Goth C, Franke J, Risch F Conference contribution Laser-Based Powder Bed Fusion of Copper Powder on Aluminum Nitride Ceramics for Power Electronic Applications (2025) Utsch D, Turowski T, Hecht C, Thielen N, Ockel M, Franke J, Risch F Journal article
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