Near-Chip 3D Functionalization of Direct Copper Bonded Substrates in Power Electronic Modules

Hecht C, Wiegand D, Sippel M, Franke J, Ockel M (2026)

Publication Type: Conference contribution

Publication year: 2026

Publisher: Institute of Electrical and Electronics Engineers Inc.

Pages Range: 341-342

Conference Proceedings Title: 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS 2026

Event location: Hiroshima JP

ISBN: 9784991483516

DOI: 10.23919/ICEP-HBS69241.2026.11550637

Abstract

Metal-ceramic substrates are key components in modern power electronic modules and strongly influence their performance and reliability. Established and widely used processes for metal-ceramic substrates in power electronics produce planar metallizations, which limit heat dissipation concepts. This paper presents a novel approach for near-chip 3D functionalization of planar metallizations on ceramic substrates using laser-based powder bed fusion of metals. Copper structures are additively manufactured directly onto standard metal-ceramic substrates without the need for tooling or additional chemical etching processes. The functionalized substrates are investigated with respect to process feasibility, thermal performance, and reliability. The results demonstrate a significant reduction in maximum chip temperature due improved heat dissipation by the additively manufactured Cu structures. However, active power cycling reveals a reduced lifetime of modules with functionalized substrates, mainly caused by increased thermomechanical stresses on the die attach solder and ceramic insulation layer. Overall, the study highlights the high potential of additive 3D metallization for enhanced thermal management in power electronics.

Authors with CRIS profile

Christoph Hecht Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Manuela Ockel Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

How to cite

APA:

Hecht, C., Wiegand, D., Sippel, M., Franke, J., & Ockel, M. (2026). Near-Chip 3D Functionalization of Direct Copper Bonded Substrates in Power Electronic Modules. In 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS 2026 (pp. 341-342). Hiroshima, JP: Institute of Electrical and Electronics Engineers Inc..

MLA:

Hecht, Christoph, et al. "Near-Chip 3D Functionalization of Direct Copper Bonded Substrates in Power Electronic Modules." Proceedings of the 25th International Conference on Electronics Packaging, held in conjunction with the IEEE EPS Hybrid Bonding Symposium, ICEP-HBS2026, Hiroshima Institute of Electrical and Electronics Engineers Inc., 2026. 341-342.

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