Lehrstuhl für Elektronische Bauelemente

Simulation-Guided Analysis towards Trench Depth Optimization for Enhanced Flexibility in Stretch-Free, Shape-Induced Interconnects for Flexible Electronics (2024) Joch D, Lang T, Sanctis S, Jank M Journal article Ammonothermal Crystal Growth of Functional Nitrides for Semiconductor Devices: Status and Potential (2024) Wostatek T, Chirala VYMR, Stoddard N, Civas EN, Pimputkar S, Schimmel S Journal article, Review article Low-temperature performance of GeSn-on-Si avalanche photodiodes toward single-photon detection (2024) Wanitzek M, Hack M, Schwarz D, Schulze J, Oehme M Journal article Adhesion strength of ductile thin film determined by cross-sectional nanoindentation (2024) Zhao D, Letz S, Jank M, März M Journal article Entwicklung und Optimierung eines Ball-Wedge-Wirebond-Prozesses für kleine Kontaktpads (2024) Schmid F Thesis Utilizing direct Zener tunneling in Germanium for cryogenic quantum applications (2024) Hack M, Seidel L, Wanitzek M, Oehme M, Schulze J, Schwarz D Journal article Fundamentals of ammonothermal growth of nitride crystals (2024) Chirala VYMR, Schimmel S Conference contribution, Abstract of a poster Increasing 4H-SiC Trench Depth by Improving the Dry Etch Selectivity towards the Oxide Hard Mask (2024) Rusch O, Brueckner K, Erlbacher T Book chapter / Article in edited volumes A 4H-SiC CMOS Technology enabling Smart Sensor Integration and Circuit Operation above 500 °C (2024) May A, Rommel M, Baier L, Schraml M, Dick J, Jank M, Schulze J Conference contribution Integrated Mask Process Modeling for Better Yield Predictions (2024) Awad A, Behroozi C, Erdmann A Conference contribution