Materials Science Forum

Journal Abbreviation: MATER SCI FORUM
ISSN: 0255-5476
eISSN: 1662-9752
Publisher: Trans Tech Publications

Publications (173)

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Unpublished / Preprint

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New SiC epitaxial growth process with up to 100% BPD to TED defect conversion on 150mm hot-wall CVD reactor (2019) Höchbauer T, Heidorn C, Tsavdaris N Conference contribution On the origin of charge compensation in aluminum-implanted n-type 4H-SiC by analysis of hall effect measurements (2019) Weiße J, Hauck M, Sledziewski T, Krieger M, Bauer A, Mitlehner H, Frey L, Erlbacher T Conference contribution Design considerations for robust manufacturing and high yield of 1.2 kv 4H-SIC VDMOS transistors (2019) Schlichting H, Sledziewski T, Bauer AJ, Erlbacher T Conference contribution Influence of trench design on the electrical properties of 650v 4H-SIC JBS diodes (2019) Rusch O, Moult J, Erlbacher T Conference contribution Design of a 4H-SIC resurf N-LDMOS transistor for high voltage integrated circuits (2019) Weiße J, Mitlehner H, Frey L, Erlbacher T Conference contribution Tracking of the growth interface during pvt-growth of SiC boules using a X-ray computed tomography setup (2019) Arzig M, Salamon M, Uhlmann N, Wellmann P Journal article, Original article Channeling in 4H-SiC from an application point of view (2019) Pichler P, Sledziewski T, Häublein V, Bauer AJ, Erlbacher T Conference contribution Determination of Performance-Relevant Trapped Charge in 4H Silicon Carbide MOSFETs (2018) Rasinger F, Pobegen G, Aichinger T, Weber HB, Krieger M Journal article, Letter Growth conditions and in situ computed tomography analysis of facetted bulk growth of SiC boules (2018) Arzig M, Salamon M, Uhlmann N, Johansen BA, Wellmann P Journal article, Original article Analysis of Compensation Effects in Aluminum-Implanted 4H-SiC Devices (2018) Weiße J, Hauck M, Sledziewski T, Tschiesche M, Krieger M, Bauer A, Mitlehner H, et al. Journal article, Report