An Analytical Approach to Thermal Design for Manufacturing in Mini Wave Soldering

Seidel R, Sippel M, Franke J (2021)

Publication Type: Conference contribution

Publication year: 2021

Journal

Proceedings - Electronic Components and Technology Conference Institute of Electrical and Electronics Engineers

Publisher: IEEE COMPUTER SOC

City/Town: LOS ALAMITOS

Pages Range: 1427-1434

Conference Proceedings Title: IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)

Event location: , ELECTR NETWORK

DOI: 10.1109/ECTC32696.2021.00228

Authors with CRIS profile

Reinhardt Seidel Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Marcel Sippel Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

How to cite

APA:

Seidel, R., Sippel, M., & Franke, J. (2021). An Analytical Approach to Thermal Design for Manufacturing in Mini Wave Soldering. In IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021) (pp. 1427-1434). , ELECTR NETWORK: LOS ALAMITOS: IEEE COMPUTER SOC.

MLA:

Seidel, Reinhardt, Marcel Sippel, and Jörg Franke. "An Analytical Approach to Thermal Design for Manufacturing in Mini Wave Soldering." Proceedings of the IEEE 71st Electronic Components and Technology Conference (ECTC), , ELECTR NETWORK LOS ALAMITOS: IEEE COMPUTER SOC, 2021. 1427-1434.

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