Marcel Sippel

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle (2024) Sippel M, Tan YF, Schmidt R, Botazzoli P, Sprenger M, Franke J Journal article Mobile ions entering the IGBT gate oxide - electrical detection and failure localization by lock-in thermography (2023) Käsbauer M, Dreher P, Sippel M, Schmidt R Journal article Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics (2023) Utsch D, Häußler F, Voigt C, Sippel M, Franke J Conference contribution, Conference Contribution Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications (2023) Alzoubi K, Hensel A, Häußler F, Ottinger B, Sippel M, Franke J Journal article Influence of the Bond Foot Angle on Active Power Cycling Lifetime of Wire Bonds (2023) Sippel M, Tan YF, Schmidt R, Botazzoli P, Sprenger M, Franke J Conference contribution A Conceptional Study towards Developing a Novel Copper Top-Side Interconnection Process in Power Electronics using Additive Manufacturing (2023) Ockel M, Sippel M, Hecht C, Janisch L, Franke J Conference contribution, Conference Contribution High Temperature Die Attach: Study and Power Cycling of Direct-Bonded Silver Joints (2022) Häußler F, Sippel M, Sprenger M, Liu L, Muckelbauer M, Franke J Conference contribution 2-D Fluid Simulation Approach for Miniwave Soldering (2022) Seidel R, Sippel M, Franke J Conference contribution Power Cycling Lifetime of Shunt Resistors in IGBT Modules (2022) Schmidt R, Kaesbauer M, Endres M, Sippel M, Botazzoli P Conference contribution Improved Thermal Impedance Measurement for Power Modules based on Thermal Imaging of the Baseplate (2022) Sippel M, Schmidt R, Rau F, Bretscher D, Seidel R, Franke J Conference contribution