Marcel Sippel

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

Assessment and improvement of adhesion of printed silver-based inks on alumina produced by fused filament fabrication (2024) Utsch D, Sippel M, Voigt C, Häußler F, Franke J Journal article Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle (2024) Sippel M, Tan YF, Schmidt R, Botazzoli P, Sprenger M, Franke J Journal article Mobile ions entering the IGBT gate oxide - electrical detection and failure localization by lock-in thermography (2023) Käsbauer M, Dreher P, Sippel M, Schmidt R Journal article Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics (2023) Utsch D, Häußler F, Voigt C, Sippel M, Franke J Conference contribution, Conference Contribution Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications (2023) Alzoubi K, Hensel A, Häußler F, Ottinger B, Sippel M, Franke J Journal article Influence of the Bond Foot Angle on Active Power Cycling Lifetime of Wire Bonds (2023) Sippel M, Tan YF, Schmidt R, Botazzoli P, Sprenger M, Franke J Conference contribution A Conceptional Study towards Developing a Novel Copper Top-Side Interconnection Process in Power Electronics using Additive Manufacturing (2023) Ockel M, Sippel M, Hecht C, Janisch L, Franke J Conference contribution, Conference Contribution High Temperature Die Attach: Study and Power Cycling of Direct-Bonded Silver Joints (2022) Häußler F, Sippel M, Sprenger M, Liu L, Muckelbauer M, Franke J Conference contribution 2-D Fluid Simulation Approach for Miniwave Soldering (2022) Seidel R, Sippel M, Franke J Conference contribution Power Cycling Lifetime of Shunt Resistors in IGBT Modules (2022) Schmidt R, Kaesbauer M, Endres M, Sippel M, Botazzoli P Conference contribution