Reinhardt Seidel



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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

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Abstract

Journal

Development and validation of a digital twin framework for SMT manufacturing (2023) Seidel R, Rachinger B, Thielen N, Schmidt K, Meier S, Franke J Journal article Impact of THT-hole dimensioning on manufacturability in selective wave soldering (2022) Seidel R, Ockel M, Franke J, Kästle C Journal article 2-D Fluid Simulation Approach for Miniwave Soldering (2022) Seidel R, Sippel M, Franke J Conference contribution Improved Thermal Impedance Measurement for Power Modules based on Thermal Imaging of the Baseplate (2022) Sippel M, Schmidt R, Rau F, Bretscher D, Seidel R, Franke J Conference contribution Experimental identification and prioritization of design and process parameters on hole fill in mini wave soldering (2022) Seidel R, Ahrens T, Friedrich J, Reinhardt A, Franke J Journal article Trustworthiness of machine learning models in manufacturing applications using the example of electronics manufacturing processes (2022) Seidel R, Schmidt K, Thielen N, Franke J Conference contribution Clustering of Image Data to Enhance Machine Learning Based Quality Control in THT Manufacturing (2021) Thielen N, Jiang Z, Schmidt K, Seidel R, Voigt C, Reinhardt A, Franke J Conference contribution An Analytical Approach to Thermal Design for Manufacturing in Mini Wave Soldering (2021) Seidel R, Sippel M, Franke J Conference contribution Enhanced X-Ray Inspection of Solder Joints in SMT Electronics Production using Convolutional Neural Networks (2020) Schmidt K, Thielen N, Voigt C, Seidel R, Franke J, Milde Y, Bonig J, Beitinger G Conference contribution Data Mining System Architecture for Industrial Internet of Things in Electronics Production (2020) Seidel R, Hassan Amada M, Fuchs J, Thielen N, Schmidt K, Voigt C, Franke J Conference contribution