Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies

Bräuer P, Stoll T, Muckelbauer M, Hensel A, Franke J (2022)


Publication Type: Conference contribution

Publication year: 2022

Journal

Publisher: IEEE

City/Town: NEW YORK

Pages Range: 992-999

Conference Proceedings Title: IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)

Event location: San Diego, CA US

DOI: 10.1109/ECTC51906.2022.00162

Authors with CRIS profile

How to cite

APA:

Bräuer, P., Stoll, T., Muckelbauer, M., Hensel, A., & Franke, J. (2022). Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies. In IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022) (pp. 992-999). San Diego, CA, US: NEW YORK: IEEE.

MLA:

Bräuer, Philipp, et al. "Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies." Proceedings of the 72nd IEEE Electronic Components and Technology Conference (ECTC), San Diego, CA NEW YORK: IEEE, 2022. 992-999.

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