Bräuer P, Stoll T, Muckelbauer M, Hensel A, Franke J (2022)
Publication Type: Conference contribution
Publication year: 2022
Publisher: IEEE
City/Town: NEW YORK
Pages Range: 992-999
Conference Proceedings Title: IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)
DOI: 10.1109/ECTC51906.2022.00162
APA:
Bräuer, P., Stoll, T., Muckelbauer, M., Hensel, A., & Franke, J. (2022). Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies. In IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022) (pp. 992-999). San Diego, CA, US: NEW YORK: IEEE.
MLA:
Bräuer, Philipp, et al. "Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies." Proceedings of the 72nd IEEE Electronic Components and Technology Conference (ECTC), San Diego, CA NEW YORK: IEEE, 2022. 992-999.
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