Thomas Stoll

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

Manufacturing of Ceramic Based Mechatronic Integrated Devices Using Laser-Direct-Structuring (2022) Bräuer P, Stoll T, Muckelbauer M, Häußler F, Hensel A, Franke J Conference contribution Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies (2022) Bräuer P, Stoll T, Muckelbauer M, Hensel A, Franke J Conference contribution Review of the direct bonded copper (DBC) process and its adaption to laser powder bed fusion (LPBF) (2022) Stoll T, Feuerer T, Hensel A, Franke J Conference contribution Process development for laser powder bed fusion of pure copper (2020) Stoll T, Trautnitz P, Schmiedeke S, Franke J, Travitzky N Journal article A new development of micro-copper sinter material for high power electronics application (2020) Schwarzer C, Chew LM, Stoll T, Franke J, Kaloudis M Conference contribution Generation of 3-dimensional power modules for high temperature applications by thermal copper coating processes (2019) Hensel A, Schwarzer C, Merz C, Stoll T, Kaloudis M, Franke J Conference contribution A novel approach of copper-ceramic-joints manufactured by selective laser melting (2019) Stoll T, Kirstein M, Franke J Journal article Electrical and Mechanical Qualification of Selectively Dispensed Active Brazes (2018) Stoll T, Franke J Conference contribution The future of short-range high-speed data transmission: printed polymer optical waveguides (POW) innovation, fabrication, and challenges (2018) Reitberger T, Stoll T, Hoffmann GA, Lorenz L, Neermann S, Overmeyer L, Bock K, et al. Journal article Additive Manufacturing of 3D-copper-metallizations on Alumina by means of Selective Laser Melting for Power Electronic Applications (2018) Stoll T, Kirstein M, Franke J Book chapter / Article in edited volumes