Complex 3D structures via double imprint of hybrid structures and sacrificial mould techniques

Steinberg C, Rumler M, Manuel RA, Papenheim M, Wang S, Mayer A, Becker M, Rommel M, Scheer HC (2017)

Publication Type: Journal article

Publication year: 2017

Journal

Microelectronic Engineering Elsevier

Book Volume: 176

Pages Range: 22-27

DOI: 10.1016/j.mee.2017.01.009

Abstract

The preparation of transparent complex 3D structures over large areas at low cost paves the way for numerous optical applications. We prepared nanostructures on the surface of microstructures in a negative tone photoresist by a double imprint process combined with VUV-induced surface hardening. Successful preparation of the aforementioned structures asks for a compromise between the surface hardening of the nanostructures and the replication fidelity of the microstructures. Our results show that a VUV treatment time of at least 3 s is required so that the cross-linked layer does not break-up. Adequate process parameters as well as their limiting values were identified by using high aspect ratio microstructures. The complex 3D structures were successfully replicated in UV-PDMS to provide long-term stable templates. To ensure effective separation despite of the undercuts a sacrificial mould technique is applied.

Authors with CRIS profile

Maximilian Rumler Lehrstuhl für Elektronische Bauelemente

Additional Organisation(s)

Exzellenz-Cluster Engineering of Advanced Materials (EAM)

Involved external institutions

Bergische Universität Wuppertal DE Germany (DE) NanoWorld Services GmbH DE Germany (DE) Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB) DE Germany (DE)

How to cite

APA:

Steinberg, C., Rumler, M., Manuel, R.A., Papenheim, M., Wang, S., Mayer, A.,... Scheer, H.-C. (2017). Complex 3D structures via double imprint of hybrid structures and sacrificial mould techniques. Microelectronic Engineering, 176, 22-27. https://doi.org/10.1016/j.mee.2017.01.009

MLA:

Steinberg, Christian, et al. "Complex 3D structures via double imprint of hybrid structures and sacrificial mould techniques." Microelectronic Engineering 176 (2017): 22-27.

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