Dynamic Characterization of Molded Devices and Fundamental Investigations on Reliability (ZuGaNG)

Third Party Funds Group - Sub project


Acronym: ZuGaNG

Start date : 01.04.2014

End date : 31.03.2017

Extension date: 30.06.2017

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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

From
To

Abstract

Journal

Fundamental Efficiency Limits in Power Electronic Systems (2016) Heckel T, Rettner C, März M Conference contribution, Conference Contribution Slew rate control of a 600 V 55 mΩ GaN cascode (2016) Endruschat A, Heckel T, Reiner R, Waltereit P, Quay R, Ambacher O, März M, et al. Conference contribution, Conference Contribution A Novel Charge Based SPICE Model for Nonlinear Device Capacitances (2015) Heckel T, Frey L Conference contribution, Conference Contribution High Power Density Automotive Converters using SiC or GaN Power Devices (2015) Eckardt B, Heckel T Conference contribution, Conference Contribution