Marcel Sippel

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Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)
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Types of publications

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Book chapter / Article in edited volumes
Authored book
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Conference contribution
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Unpublished / Preprint

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Abstract

Journal

2-D Fluid Simulation Approach for Miniwave Soldering (2022) Seidel R, Sippel M, Franke J Conference contribution Power Cycling Lifetime of Shunt Resistors in IGBT Modules (2022) Schmidt R, Kaesbauer M, Endres M, Sippel M, Botazzoli P Conference contribution Improved Thermal Impedance Measurement for Power Modules based on Thermal Imaging of the Baseplate (2022) Sippel M, Schmidt R, Rau F, Bretscher D, Seidel R, Franke J Conference contribution Influence of Current Density on Wire Bond Lifetime in Active Power Cycling Test (2022) Sippel M, Schmidt R, Kaesbauer M, Sprenger M, Hensel A, Franke J Conference contribution Laser Cleaning of Flux Residues on Copper Surfaces in Electronics Production (2022) Hecht C, Slama JN, Sprenger M, Haubler F, Sippel M, Franke J Conference contribution Impact of Aluminum Metallization Reconstruction on the Current Distribution in Power Semiconductors (2022) Sippel M, Hassel S, Schmidt R, Sprenger M, Hecht C, Franke J Conference contribution Hard encapsulation of automotive power modules by epoxy potting-encapsulant selection assisted by thermo-mechanical simulation (2022) Sprenger M, Forndran F, Ottinger B, Dammann T, Erben B, Sippel M, Franke J Conference contribution An Analytical Approach to Thermal Design for Manufacturing in Mini Wave Soldering (2021) Seidel R, Sippel M, Franke J Conference contribution Power Cycle Testing at Low Temperature Swings – Evaluating the Stability of SAC- and SnSb-based Chip Solder Layers (2020) Schmidt R, Kaesbauer M, Sippel M, Dreher P Conference contribution
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