Dr.-Ing. Christian Carlowitz



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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

From
To

Abstract

Journal

Towards Solid-State High-Power 13.56 MHz Impedance Matching Using Self-Biased SiC-MOSFET-Switched Capacitors (2026) Schwab N, Vennemann P, Gesche R, Carlowitz C, Vossiek M Conference contribution Sub-THz Signal Distribution Based on Additively Manufactured Dielectric Image Lines (2026) Hahn L, Bürk L, Bader T, Panusch D, Carlowitz C, Gold G, Vossiek M Journal article Model Parameter Estimation of Passive Components at Millikelvin Temperatures for Cryogenic Microwave Circuit Design (2025) Zocher N, Vossiek M, Carlowitz C Conference contribution 3D-Printed Broadband Dielectric Image Line Splitters for sub-THz Applications (2025) Hahn L, Gloßner M, Bürk L, Carlowitz C, Gold G, Vossiek M Conference contribution Integrated Time Domain Multiplexer for Superconducting Qubit Control at Millikelvin Temperatures (2025) Schöpplein V, Breun S, Löffler J, Koch M, Loose M, Dietz M, Carlowitz C, et al. Conference contribution, Conference Contribution Diffuser-Based LIDAR Signal Acquisition for Fast and Compact All-Optical Target Simulators (2024) Rittler A, Carlowitz C Conference contribution Quasi-Optical Directional Coupler Based on 3D-Printed Dielectric Image Lines for sub-THz Applications (2024) Hahn L, Bürk L, Zhu Y, Carlowitz C, Gold G, Ellinger F, Vossiek M Conference contribution Printed Circuit Board Material Characterization at Millikelvin Temperatures for Cryogenic Microwave Circuit Design (2024) Zocher N, Pfahler T, Vossiek M, Carlowitz C Conference contribution Tight Non-Radiating Bends of 3D-Printed Dielectric Image Lines Based on Electromagnetic Bandgap Mirrors (2024) Hahn L, Bader T, Carlowitz C, Vossiek M, Gold G Conference contribution 3D-Printed Dielectric Image Lines Towards Chip-to-Chip Interconnects for subTHz-Applications (2024) Hahn L, Pfahler T, Bader T, Gold G, Vossiek M, Carlowitz C Conference contribution