Thomas Heckel

Lehrstuhl für Elektronische Bauelemente

Silicon integrated RC snubbers for applications up to 900V with reduced mechanical stress and high manufacturability (2016) Krach F, Thielen N, Heckel T, Bauer A, Erlbacher T, Frey L, Heckel T Other publication type, conference paper Inductive high data rate transmission for bearing systems (2016) Ziller J, Dräger T, Heckel T Conference contribution, Conference Contribution Innovative Monolithic RC-Snubber for Fast Switching Power Modules (2016) Krach F, Heckel T, Frey L, Bauer A, Erlbacher T, März M Conference contribution, Conference Contribution Inductive power transfer system with a rotary transformer for contactless energy transfer on rotating applications (2016) Ditze S, Endruschat A, Schriefer T, Rosskopf A, Heckel T Conference contribution, Conference Contribution Fundamental Efficiency Limits in Power Electronic Systems (2016) Heckel T, Rettner C, März M Conference contribution, Conference Contribution Using SiC MOSFET’s full potential – Switching faster than 200 kV/μs (2016) Kreutzer O, Heckel T, März M Authored book, Volume of book series Integrated galvanically isolated MOSFET and IGBT gate-driver circuit with switching speed control (2016) Lorentz V, Schwarz R, Heckel T, März M, Frey L, Heckel T Conference contribution, Conference Contribution Slew rate control of a 600 V 55 mΩ GaN cascode (2016) Endruschat A, Heckel T, Reiner R, Waltereit P, Quay R, Ambacher O, März M, et al. Conference contribution, Conference Contribution Implementation of Simultaneous Energy and Data Transfer in a Contactless Connector (2016) Trautmann M, Joffe C, Pflaum F, Sanftl B, Weigel R, Heckel T, Kölpin A Conference contribution A Novel Charge Based SPICE Model for Nonlinear Device Capacitances (2015) Heckel T, Frey L Conference contribution, Conference Contribution