Martin Muckelbauer



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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

From
To

Abstract

Journal

Highly efficient and flexible plasma based copper coating process for the manufacture of direct metallized mechatronic devices (2017) Müller M, Franke J Conference contribution Copper circuit traces by laser cladding with powder injection for additive manufactured mechatronic devices (2017) Müller M, Hentschel O, Schmidt M, Franke J Conference contribution Additive Copper Metallization of Semiconductors for Enabling a Copper Wire Bonding Process (2017) Hensel A, Müller M, Kohlmann-von Platen K, Franke J Conference contribution, Conference Contribution Feasibility study of generating mechatronic devices by digital direct metallization with a plasma based copper coating process (2016) Müller M, Franke J Conference contribution High performance accelerated test methods for reliability and life time analyses of power electronic packages (2016) Müller M, Franke J Conference contribution A Comprehensive Study on the Automation Potentials and Complexities of Advanced and Alternative Die-Attach Technologies for Power Electronic Applications (2015) Syed Khaja AH, Kästle C, Müller M, Franke J Journal article Highly efficient packaging processes by reactive multilayer materials for die-attach in power electronic applications (2014) Müller M, Franke J Conference contribution Assembly and Interconnection Technologies for MID based on Thermally Conductive Plastics for Heat Dissipation (2011) Hörber J, Müller M, Franke J, Ranft F, Heinle C, Drummer D Conference contribution Wärmeverteilung in elektronischen Baugruppen optimieren (2011) Hörber J, Ranft F, Müller M, Franke J, Drummer D Journal article