Müller M, Franke J (2017)
Publication Type: Conference contribution
Publication year: 2017
Publisher: Institute of Electrical and Electronics Engineers Inc.
Pages Range: 365-369
Conference Proceedings Title: Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016
Event location: Singapore, SGP
ISBN: 9781509043682
DOI: 10.1109/EPTC.2016.7861506
The plasma based copper coating process is an innovative process for the production of planar or three dimensional circuit carriers. Both conductor lines for logic circuits and conductors for high power transmissions can be realized. This paper describes the manufacturing process chain of direct metallization by plasma based copper coating and shows the potentials of this technology. Circuits can be applied to almost any base substrate such as polymers, ceramics or even metal since an insulating dielectric lacquer layer separates the substrate from the metallization. In contrast to previous plasma based copper depositing processes the digital direct metallization enables clearly defined fine structures without using any inflexible and high-maintenance masks [1]. An enormous advantage of this procedure is the complete elimination of wet chemical process steps, which are known from the laser direct structuring method (LDS) [2]. In addition to diverse characterizations this paper represents the opportunities of the technology by means of demonstrator applications.
APA:
Müller, M., & Franke, J. (2017). Highly efficient and flexible plasma based copper coating process for the manufacture of direct metallized mechatronic devices. In Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016 (pp. 365-369). Singapore, SGP: Institute of Electrical and Electronics Engineers Inc..
MLA:
Müller, Martin, and Jörg Franke. "Highly efficient and flexible plasma based copper coating process for the manufacture of direct metallized mechatronic devices." Proceedings of the 18th IEEE Electronics Packaging Technology Conference, EPTC 2016, Singapore, SGP Institute of Electrical and Electronics Engineers Inc., 2017. 365-369.
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