Siemens AG

Industry / private company


Location: Nürnberg, München, Germany (DE) DE

ISNI: 000000012178835X

ROR: https://ror.org/059mq0909

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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

From
To

Abstract

Journal

Phase Restoring Principle: Concept of a novel grid-forming converter scheme (2022) Kuri A, Zurowski R, Mehlmann G, Audring D, Luther M Conference contribution, Original article Impact of THT-hole dimensioning on manufacturability in selective wave soldering (2022) Seidel R, Ockel M, Franke J, Kästle C Journal article Converter Modelling Aspects at the Boundary between EMT and RMS Domain (2022) Kuri A, Zurowski R, Mehlmann G, Luther M Conference contribution, Conference Contribution Numerical measurement uncertainty evaluation for X-ray computed tomography using simulations – A first approach to build a digital twin (2022) Reuter T, Plotzki D, Borges de Oliveira F, Wohlgemuth F, Bauer F, Ballach F, Kimmig W, et al. Journal article ZugChain: Blockchain-Based Juridical Data Recording in Railway Systems (2022) Schwarz-Rüsch S, Bleeke K, Messadi I, Schmidt S, Krampf A, Olze K, Stahnke S, et al. Conference contribution, Conference Contribution Training Deep Learning Models for 2D Spine X-rays Using Synthetic Images and Annotations Created from 3D CT Volumes (2022) Sukesh R, Fieselmann A, Jaganathan S, Shetty K, Kaergel R, Kordon FJ, Kappler S, Maier A Conference contribution Deep learning based denoising of mammographic x-ray images: an investigation of loss functions and their detail-preserving properties (2022) Eckert D, Ritschl L, Herbst M, Wicklein J, Vesal S, Kappler S, Maier A, Stober S Conference contribution Highly Dynamic 2-DOF Cable-Driven Robotic Wrist based on a Novel Topology (2022) Nemoto T, Walter J, Bachmann C, Gerlich M, Reitelshöfer S, Franke J Journal article Power Cycling Lifetime of Shunt Resistors in IGBT Modules (2022) Schmidt R, Kaesbauer M, Endres M, Sippel M, Botazzoli P Conference contribution Improved Thermal Impedance Measurement for Power Modules based on Thermal Imaging of the Baseplate (2022) Sippel M, Schmidt R, Rau F, Bretscher D, Seidel R, Franke J Conference contribution