Utsch D, Turowski T, Hecht C, Thielen N, Ockel M, Franke J, Risch F (2025)
Publication Type: Journal article
Publication year: 2025
Book Volume: 8
Pages Range: 105
Issue: 3
As power electronic modules are increasingly required to provide improved heat dissipation, aluminum nitride (AlN) stands out against other ceramic materials. At the same time, more cost-efficient production of customized products demands shorter development cycles and innovative manufacturing processes. Conventional process chains in power electronics are usually long and inflexible; thus, innovative ways to reduce process steps and faster prototyping are needed. Therefore, this study investigates the usage of additive manufacturing technology—laser-based powder bed fusion of metal powder (PBF-LB/M)—namely copper (Cu), on AlN substrates for power electronic applications. It is found that specific electrical conductivity values can be achieved up to 31 MS/m, and adhesion measured by shear testing reaches 15 MPa. In reliability testing, the newly produced samples exhibit a 25% decrease in adhesion after 250 cycles, which is comparatively moderate. This study shows the feasibility of PBF-LB/M of Cu powder on AlN, emphasizing its strengths and highlighting remaining weaknesses.
APA:
Utsch, D., Turowski, T., Hecht, C., Thielen, N., Ockel, M., Franke, J., & Risch, F. (2025). Laser-Based Powder Bed Fusion of Copper Powder on Aluminum Nitride Ceramics for Power Electronic Applications. Ceramics, 8, 105. https://doi.org/10.3390/ceramics8030105
MLA:
Utsch, Daniel, et al. "Laser-Based Powder Bed Fusion of Copper Powder on Aluminum Nitride Ceramics for Power Electronic Applications." Ceramics 8 (2025): 105.
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