Daniel Utsch



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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

From
To

Abstract

Journal

Mechanical qualification and microstructural analysis of alumina produced by material extrusion (2023) Utsch D, Bründl P, Franke J, Erdogan H Journal article Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics (2023) Utsch D, Häußler F, Voigt C, Sippel M, Franke J Conference contribution, Conference Contribution Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication (2023) Utsch D, Häußler F, Sprenger M, Zirn J, Franke J Conference contribution Generation of RF Structures on Additively Manufactured Substrates by Printed Electronics and Laser Structuring (2023) Ankenbrand M, Panusch D, Utsch D, Banea K, Ehrngruber M, Gold G, Helmreich K, Franke J Conference contribution, Conference Contribution Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components (2023) Voigt C, Petersen M, Thielen N, Utsch D, Häußler F, Kirchberger M, Franke J Conference contribution, Conference Contribution Investigations on processing copper-titanium powder blends via PBF-LB/M (2023) Hecht C, Schüller D, Utsch D, Stoll T, Franke J Book chapter / Article in edited volumes Additive4Industry - Printed electronics on 3D substrates. Mit keramischen Materialien zu temperaturbeständigeren elektronischen Baugruppen (2022) Utsch D Other publication type Additive Manufacturing of 3D Circuit Carriers with Improved Thermal Conductivity (2022) Utsch D, Piechulek N, Franke J Conference contribution Herstellung räumlicher Schaltungsträger mit keramischen Materialien mittels digitaler Fertigungsverfahren (2022) Utsch D, Milich N, Ankenbrand M, Franke J Conference contribution, Conference Contribution Electromagnetic Actuators Suitable for High Temperatures Using Thin Aluminum Foil as Conductor (2022) von Lindenfels J, Qomi MP, Utsch D, Franke J, Kühl A, Reibenweber L, Stadler A Conference contribution