Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components

Voigt C, Petersen M, Thielen N, Utsch D, Häußler F, Kirchberger M, Franke J (2023)

Publication Type: Conference contribution, Conference Contribution

Subtype: other

Publication year: 2023

Pages Range: 1-6-6

Conference Proceedings Title: 2023 46th International Spring Seminar on Electronics Technology (ISSE)

Event location: Timisoara RO

DOI: 10.1109/ISSE57496.2023.10168387

Abstract

This paper explores a method for contacting Surface Mount Devices (SMD) using inkjet-printed media. A series of experiments is conducted to determine the needed layer thickness, drop size, and print parameters to facilitate adequate connections and evaluates the mechanical forces needed to break such a connection. Analysis of the joining partners using laser scan microscopy indicates necessary ink volumes between 75.1*10 3 and 800*10 3 μm 3 of connective media depending on the SMD size. The necessary amount of material is delivered to the substrate surface using inkjet printing, with the appropriate dwell voltage being determined in a separate experiment. After sintering for 10 minutes at 150°C, the inkjet-printed connections demonstrated electrical conduction in testing but showed 43% less resistance to shear forces, when compared to conventionally soldered connections, indicating a need for further optimization regarding the adhesive properties of the ink. The study provides insights for developing mechanically and electrically stable connections using inkjet-printed media, although further refinement is needed with regards to ink formulation and sintering time.

Authors with CRIS profile

Christian Voigt Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Matthias Petersen Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Nils Thielen Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Daniel Utsch Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Felix Häußler Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

How to cite

APA:

Voigt, C., Petersen, M., Thielen, N., Utsch, D., Häußler, F., Kirchberger, M., & Franke, J. (2023). Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components. In 2023 46th International Spring Seminar on Electronics Technology (ISSE) (pp. 1-6-6). Timisoara, RO.

MLA:

Voigt, Christian, et al. "Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components." Proceedings of the International Spring Seminar on Electronics Technology, Timisoara 2023. 1-6-6.

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