Christian Voigt

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics (2023) Utsch D, Häußler F, Voigt C, Sippel M, Franke J Conference contribution, Conference Contribution Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components (2023) Voigt C, Petersen M, Thielen N, Utsch D, Häußler F, Kirchberger M, Franke J Conference contribution, Conference Contribution Simulationsgestütztes Vorgehensmodell zur Realisierung einer Matrixfertigung (2022) Kirchberger M, Heeger M, Altay A, Liebrecht C, Overbeck L, Kandler M, Lanza G, et al. Journal article Machine Learning Based Quality Prediction for Solder Paste Dispensing in Electronics Production (2022) Thielen N, Pan W, Piechulek N, Voigt C, Meier S, Schmidt K, Franke J Conference contribution An Automated Optical Inspection System for PIP Solder Joint Classification Using Convolutional Neural Networks (2021) Schmidt K, Rauchensteiner D, Voigt C, Thielen N, Bönig J, Beitinger G, Franke J Conference contribution, Conference Contribution An Analysis of Redundancy in High Volume High Mix Quality Testing Systems in Electronics Production (2021) Voigt C, Harnecker L, Kirchberger M, Franke J Conference contribution Evaluation of Influences on Accuracy of Radiographic Measurements of Solder Joint Volume (2021) Voigt C, Hagag A, Kirchberger M, Franke J Conference contribution Clustering of Image Data to Enhance Machine Learning Based Quality Control in THT Manufacturing (2021) Thielen N, Jiang Z, Schmidt K, Seidel R, Voigt C, Reinhardt A, Franke J Conference contribution Enhanced X-Ray Inspection of Solder Joints in SMT Electronics Production using Convolutional Neural Networks (2020) Schmidt K, Thielen N, Voigt C, Seidel R, Franke J, Milde Y, Bonig J, Beitinger G Conference contribution Data Mining System Architecture for Industrial Internet of Things in Electronics Production (2020) Seidel R, Hassan Amada M, Fuchs J, Thielen N, Schmidt K, Voigt C, Franke J Conference contribution