Hard encapsulation of automotive power modules by epoxy potting-encapsulant selection assisted by thermo-mechanical simulation

Sprenger M, Forndran F, Ottinger B, Dammann T, Erben B, Sippel M, Franke J (2022)

Publication Type: Conference contribution

Publication year: 2022

Publisher: Institute of Electrical and Electronics Engineers Inc.

Conference Proceedings Title: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

Event location: St Julian MT

ISBN: 9781665458368

DOI: 10.1109/EuroSimE54907.2022.9758880

Abstract

Encapsulation with soft silicone gel by potting is the standard technology in packaging of automotive power modules with sixpack topology and highest power densities. Large-area potting of liquid hard encapsulant material is another option for realization of a hard encapsulation. Large substrate, heatsink and module size in general, multi-material stack-up, heavy cyclic thermal loads during operation, high temperature and high voltage operation possess challenges to the material choice for hard encapsulation. Within this study different power module packages have been hard encapsulated, delamination and brittle fracture of the encapsulant as well as damage of the encapsulated structure through the encapsulant are thereby observed. Corresponding thermo-mechanical simulations were set up and used to detect and investigate the failure reasons. It was found that mechanical properties of encapsulants are well adapted to the encapsulated power module packaging structures. Special attention has therefore to be put on geometrical specialties such as etching trenches and bus bar connections.

Authors with CRIS profile

Mario Sprenger Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Bettina Ottinger Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Marcel Sippel Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

Involved external institutions

Vitesco Technologies GmbH DE Germany (DE)

How to cite

APA:

Sprenger, M., Forndran, F., Ottinger, B., Dammann, T., Erben, B., Sippel, M., & Franke, J. (2022). Hard encapsulation of automotive power modules by epoxy potting-encapsulant selection assisted by thermo-mechanical simulation. In 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. St Julian, MT: Institute of Electrical and Electronics Engineers Inc..

MLA:

Sprenger, Mario, et al. "Hard encapsulation of automotive power modules by epoxy potting-encapsulant selection assisted by thermo-mechanical simulation." Proceedings of the 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022, St Julian Institute of Electrical and Electronics Engineers Inc., 2022.

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