Full wafer microlens replication by UV imprint lithography
Schmitt H, Rommel M, Bauer A, Frey L, Bich A, Eisner M, Voelkel R, Hornung M (2010)
Publication Type: Journal article
Publication year: 2010
Journal
Book Volume: 87
Pages Range: 1074--1076
Volume: 87
Issue: 5-8
Journal Issue: 5-8
DOI: 10.1016/j.mee.2009.11.069
Abstract
The fabrication of microlenses is of great interest for several applications in the field of optics like wafer level cameras, homogenization of light, and coupling of light into glass fibers. Especially for low-cost optical products, microlenses have to be fabricated with a high throughput at an adequate quality. One way to fulfil these requirements is the patterning of microlenses by UV imprint lithography (UV-IL). Within this work, microlenses were replicated into the UV curing material PAK-01 by step and stamp UV-IL on silicon substrates with a diameter of 150 mm. The resulting substrates were used as masters to cast PDMS templates. These PDMS templates can be used for high throughput full wafer UV-IL. Additionally, quartz substrates with a diameter of 100 mm were patterned which could be directly used as so called “optowafers”. Master and patterned microlenses were inspected by scanning electron microscopy and with a white light profilometer. The results clearly demonstrate the excellent quality of the replication process and the capability of UV-IL to pattern microlenses on full wafer level for high throughput applications.
Authors with CRIS profile
Additional Organisation(s)
Involved external institutions
Germany (DE)How to cite
APA:
Schmitt, H., Rommel, M., Bauer, A., Frey, L., Bich, A., Eisner, M.,... Hornung, M. (2010). Full wafer microlens replication by UV imprint lithography. Microelectronic Engineering, 87(5-8), 1074--1076. https://dx.doi.org/10.1016/j.mee.2009.11.069
MLA:
Schmitt, Holger, et al. "Full wafer microlens replication by UV imprint lithography." Microelectronic Engineering 87.5-8 (2010): 1074--1076.
BibTeX: Download