Matthias Petersen

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

Optimizing Thin Electric Functional Copper Coatings via Atmospheric Plasma Spray: Impact of Particle Temperature and Velocity (2025) Gökçen A, Ockel M, Petersen M, Thielen N, Franke J, Risch F Conference contribution Atmospheric Plasma Spraying for Copper Coating of Ceramic Solid Electrolytes for Anode-Free Solid-State Batteries with Increased Interfacial Contact (2024) Ockel M, Borchers A, Fröhlich J, Petersen M, Paschen T, Christiansen S, Franke J Conference contribution, Conference Contribution Cold Atmospheric Plasma Metallization of Power Semiconductor Bare Dies with CuSn Pseudo-Alloys for Diffusion Soldering (2024) Ockel M, Gökçen A, Ottinger B, Petersen M, Voigt C, Franke J Conference contribution, Conference Contribution Influences on the Mechanical Strength of Inkjet-Printed, Ag-Nanoparticle-Based Interconnects of Fine-Pitch Components (2024) Voigt C, Dornheim J, Muth A, Petersen M, Thielen N, Franke J Conference contribution Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components (2023) Voigt C, Petersen M, Thielen N, Utsch D, Häußler F, Kirchberger M, Franke J Conference contribution, Conference Contribution 3D-Printed Bowtie Filter Created by High Precision NanoJet System Combined with Novel Printing Strategy (2019) Sippel M, Lomakin K, Ankenbrand M, Petersen M, Franke J, Helmreich K, Vossiek M, Gold G Conference contribution, Conference Contribution Substrate pretreatments: an investigation of the effects on aerosol jet printed structures (2018) Neermann S, Scheetz M, Franke J, Roudenko J, Schirmer J, Reichenberger M Conference contribution Pushing the Boundaries of 3D-MID: Pulse-Width Modulated Light Technology for Enhancing Surface Properties and Enabling Printed Electronics on FFF-Printed Structures (2018) Gräf D, Neermann S, Stuber L, Scheetz M, Franke J Conference contribution Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations (2018) Hensel A, Schwarzer C, Scheetz M, Kaloudis M, Franke J Conference contribution Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies (2018) Ankenbrand M, Scheetz M, Franke J, Lomakin K, Sippel M, Gold G, Helmreich K Conference contribution, Conference Contribution