Alexander Hensel



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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

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To

Abstract

Journal

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications (2023) Alzoubi K, Hensel A, Häußler F, Ottinger B, Sippel M, Franke J Journal article Manufacturing of Ceramic Based Mechatronic Integrated Devices Using Laser-Direct-Structuring (2022) Bräuer P, Stoll T, Muckelbauer M, Häußler F, Hensel A, Franke J Conference contribution Influence of Current Density on Wire Bond Lifetime in Active Power Cycling Test (2022) Sippel M, Schmidt R, Kaesbauer M, Sprenger M, Hensel A, Franke J Conference contribution Suitability of a 2 kw 515 nm Continous Wave Laser for Deep Penetration Welding of Copper (2022) Ockel M, Hensel A, Franke J Conference contribution Pretreatment and Structuring of Spatial Circuit Carriers Based on Alumina for High Temperatures and High Frequencies (2022) Bräuer P, Stoll T, Muckelbauer M, Hensel A, Franke J Conference contribution Review of the direct bonded copper (DBC) process and its adaption to laser powder bed fusion (LPBF) (2022) Stoll T, Feuerer T, Hensel A, Franke J Conference contribution Investigation of Pressureless Sintered Interconnections on Plasma Based Additive Copper Metallization for 3-Dimentional Ceramic Substrates for Surface Acoustic Wave Sensors in High Temperature Applications (2020) Schwarzer C, Hensel A, Roth F, Franke J, Kaloudis M Conference contribution Generation of 3-dimensional power modules for high temperature applications by thermal copper coating processes (2019) Hensel A, Schwarzer C, Merz C, Stoll T, Kaloudis M, Franke J Conference contribution Investigation of pressureless sintered interconnections on plasma based additive copper metallization for 3-dimentional ceramic substrates in high temperature applications (2019) Schwarzer C, Hensel A, Roth F, Merz C, Franke J, Kaloudis M Conference contribution Investigations on Measuring the Thermal Conductivity of Alumina Substrates with Laser Flash Analysis (2018) Hensel A, Lê TA, Sauermann A, Franke J Conference contribution, Conference Contribution