Investigation of pressureless sintered interconnections on plasma based additive copper metallization for 3-dimentional ceramic substrates in high temperature applications
Schwarzer C, Hensel A, Roth F, Merz C, Franke J, Kaloudis M (2019)
Publication Type: Conference contribution
Publication year: 2019
Publisher: Institute of Electrical and Electronics Engineers Inc.
Conference Proceedings Title: 2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019
Event location: Pisa
ISBN: 9780956808660
DOI: 10.23919/EMPC44848.2019.8951873
Abstract
Conventional Molded interconnect device technology with spatial circuit boards offer freedom of design as well as potential for rationalization and miniaturization by electronics integration. By integrating the third dimension into the circuit design, material and cost savings can be realized. Due to the limited application temperature of thermoplastics and thermosets, the potentials of spatial assemblies cannot be fully exploited. In the field of power electronics and LED technology, ceramic substrates are increasingly gaining acceptance for thermally demanding conditions. This publication investigates the interaction of a copper interface produced in an additive metallization process of a ceramic substrate by using the Plasmacoat® method and interconnection joints formed in a pressureless silver sintering process. Therefore, copper was deposited on different ceramic substrates and different particle temperatures as well as subsequent thermal treatment were evaluated. Silver sintering on selective coated interface was investigated for later use on a three-dimensional metallized ceramic substrate. Cross sections and Shear tests reveal that forming pressureless sintered interconnections on an additively formed copper surface is more demanding compared to common direct copper bonded (DCB) substrates.
Authors with CRIS profile
Alexander Hensel
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Jörg Franke
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Involved external institutions
Germany (DE)How to cite
APA:
Schwarzer, C., Hensel, A., Roth, F., Merz, C., Franke, J., & Kaloudis, M. (2019). Investigation of pressureless sintered interconnections on plasma based additive copper metallization for 3-dimentional ceramic substrates in high temperature applications. In 2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019. Pisa, IT: Institute of Electrical and Electronics Engineers Inc..
MLA:
Schwarzer, Christian, et al. "Investigation of pressureless sintered interconnections on plasma based additive copper metallization for 3-dimentional ceramic substrates in high temperature applications." Proceedings of the 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019, Pisa Institute of Electrical and Electronics Engineers Inc., 2019.
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