Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

Investigation of the influence of dimples on the resistance of overflowed plates (2018) Praß J, Wannemacher H, Franke J, Becker S Conference contribution Additive Manufacturing of an Electric Drive - A Feasibility Study (2018) Urban N, Meyer AW, Jeckel M, Leder M, Franke J Book chapter / Article in edited volumes Infrared laser based contacting of bar-wound windings in the field of electric drives production (2018) Gläßel T, Baat F, Schwinghammer D, Seefried J, Kühl A, Franke J Conference contribution, Conference Contribution Additive waveguide manufacturing for optical bus couplers by aerosol jet printing using conditioned flexible substrates (2018) Lorenz L, Nieweglowski K, Wolter KJ, Bock K, Hoffmann GA, Overmeyer L, Reitberger T, Franke J Conference contribution, Conference Contribution Adhesion Measurements for Printed Electronics: A Novel Approach to Cross Cut Testing (2018) Schirmer J, Roudenko J, Reichenberger M, Neermann S, Franke J Conference contribution, Conference Contribution Print Quality Assessment by Image Processing Methods for Printed Electronics Applications (2018) Schirmer J, Roudenko J, Reichenberger M, Neermann S, Franke J Conference contribution, Conference Contribution Development of a joining gap control system for laser welding of zinc-coated steel sheets driven by process observation (2018) Tenner F, Eschner E, Lutz B, Schmidt M Journal article Contribution to the Reduction of Annealing Processes in the Manufacturing of Valve Solenoids by Using Inline Measuring Technology in the Caulking Process (2018) Freiherr von Lindenfels J, Heyder A, Funk S, Pigler S, Franke J Conference contribution, Original article Configuration based process and knowledge management by structuring the software landscape of global operating industrial enterprises with microservices (2018) Schäffer E, Leibinger H, Stamm A, Brossog M, Franke J Journal article, Online publication Novel Ceramic-Based Material for the Applications of Molded Interconnect Devices (3D-MID) Based on Laser Direct Structuring (2018) Bachy B, Süß-Wolf R, Wang L, Fu Z, Travitzky N, Greil P, Franke J Journal article