Novel Ceramic-Based Material for the Applications of Molded Interconnect Devices (3D-MID) Based on Laser Direct Structuring

Bachy B, Süß-Wolf R, Wang L, Fu Z, Travitzky N, Greil P, Franke J (2018)


Publication Type: Journal article

Publication year: 2018

Journal

Book Volume: 20

Article Number: 1700824

Journal Issue: 7

DOI: 10.1002/adem.201700824

Abstract

Molded interconnect devices (MID) based on laser direct structuring LPKF-LDS® technology are widely used in the realm of electronics. Nowaday, design and development of new materials with improved properties for 3D-MID are in focus. In this work, novel materials based on alumina ceramic with copper oxide additives are developed for this technology. The effect of the sintering temperature and the doping amount of copper oxide on the metallization quality is investigated. Furthermore, the influence of laser process parameters (e.g., laser power, velocity’, and frequency) on process output namely groove dimensions, groove profile, characteristics of structured area, and quality of the final 3D-MID products are discussed. The novel ceramic materials show high flexibility to realize very fine structures. Moreover, the laser-structured and metallized area shows a free edge lap with good quality. After metallization high accuracy with copper line/pitch of 16 μm/20 μm is achieved.

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How to cite

APA:

Bachy, B., Süß-Wolf, R., Wang, L., Fu, Z., Travitzky, N., Greil, P., & Franke, J. (2018). Novel Ceramic-Based Material for the Applications of Molded Interconnect Devices (3D-MID) Based on Laser Direct Structuring. Advanced Engineering Materials, 20(7). https://dx.doi.org/10.1002/adem.201700824

MLA:

Bachy, Bassim, et al. "Novel Ceramic-Based Material for the Applications of Molded Interconnect Devices (3D-MID) Based on Laser Direct Structuring." Advanced Engineering Materials 20.7 (2018).

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