Evaluation and improvement of the thermal performance of power modules using the Finite-Element-Method (FEM) and Multi-Material Additive Manufacturing (MMAM)

Lehmann CL, Utsch D, Sprenger M, Thielen N, Franke J, Risch F, Schulze V, Zanger F (2026)


Publication Type: Conference contribution

Publication year: 2026

Original Authors: Chantal-Liv Lehmann, Daniel Utsch, Mario Sprenger, Nils Thielen, Jörg Franke, Florian Risch, Volker Schulze, Frederik Zanger

Event location: Amberg DE

DOI: 10.1109/MIDCongress66428.2025.11547395

Abstract

Mechatronic Integrated Devices (MID) for high temperature and harsh environments include power electronic applications. There is a growing need for innovative packaging concepts that enhance thermal performance, and reliability while offering greater manufacturing efficiency. This work proposes a novel approach that combines the evaluation of thermal and thermo-mechanical performance of various innovative designs using numerical simulations with the design freedom of the additive manufacturing technology Vat Photopolymerization (VPP), including an advanced multi-material process with ceramic and metallic slurries. It can be found that the thermal performance is reduced by 16% using aluminum nitride as ceramic material and innovative comprised module designs, which can be demonstrated by thermal simulations and printed by VPP in one single machine.

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APA:

Lehmann, C.-L., Utsch, D., Sprenger, M., Thielen, N., Franke, J., Risch, F.,... Zanger, F. (2025). Evaluation and improvement of the thermal performance of power modules using the Finite-Element-Method (FEM) and Multi-Material Additive Manufacturing (MMAM). In Proceedings of the 2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress). Amberg, DE.

MLA:

Lehmann, Chantal-Liv , et al. "Evaluation and improvement of the thermal performance of power modules using the Finite-Element-Method (FEM) and Multi-Material Additive Manufacturing (MMAM)." Proceedings of the 2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress), Amberg 2025.

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