Dynamic Calibration of Junction Temeperature of SiC MOSFETs for Power Cycling

Breuer J, Dresel F, Schletz A, Popp J, Eckardt B, März M (2024)

Publication Type: Conference contribution

Publication year: 2024

Publisher: IEEE

City/Town: New York City

Pages Range: 1-6

Conference Proceedings Title: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)

Event location: Berlin DE

DOI: 10.1109/ESTC60143.2024.10712017

Abstract

Temperature dependent, transient effects were observed during calibration of virtual junction temperature of SiC trench MOSFETs within power cycling tests. Depending on the device design resp. semiconductor manufacturing these effects may lead to a significantly wrong junction temperature measurement thus leading to a wrong interpretation of results in lifetime testing, e.g. acc, to AQG324 PCmin, PCsec. This study investigates the time-dependent transient response of the body diode's forward voltage under test conditions with a switched gate bias applied. Based on the results, a new approach of the measurement of Tvj is proposed. This dynamic calibration method is applied to address the transient effects detected during PCT. This method is applied to SiC MOSFETs of different manufacturers. A parameter study is carried out to determine the effect of test parameters on the transient response.

Authors with CRIS profile

Martin März Lehrstuhl für Leistungselektronik (LEE)

Involved external institutions

Schletz DE Germany (DE) Leibniz-Institut für Photonische Technologien e.V. DE Germany (DE) Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB) DE Germany (DE)

How to cite

APA:

Breuer, J., Dresel, F., Schletz, A., Popp, J., Eckardt, B., & März, M. (2024). Dynamic Calibration of Junction Temeperature of SiC MOSFETs for Power Cycling. In 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) (pp. 1-6). Berlin, DE: New York City: IEEE.

MLA:

Breuer, Jakob, et al. "Dynamic Calibration of Junction Temeperature of SiC MOSFETs for Power Cycling." Proceedings of the 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Berlin New York City: IEEE, 2024. 1-6.

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