Enhancing Flexibility in Power Electronics Production: A Study on Robotic Handling of Copper Clips for Laser Bonding

Ockel M, Janisch L, Franke J, Schlichting J, Breuer M (2023)

Publication Status: Published

Publication Type: Conference contribution, Conference Contribution

Publication year: 2023

Publisher: Institute of Electrical and Electronics Engineers Inc.

Pages Range: 259-264

ISBN: 9798350315684

DOI: 10.1109/ICCMA59762.2023.10374891

Authors with CRIS profile

Manuela Ockel Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Lucas Janisch Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

Involved external institutions

Siemens AG DE Germany (DE)

How to cite

APA:

Ockel, M., Janisch, L., Franke, J., Schlichting, J., & Breuer, M. (2023). Enhancing Flexibility in Power Electronics Production: A Study on Robotic Handling of Copper Clips for Laser Bonding. In Proceedings of the 11th International Conference on Control, Mechatronics and Automation, ICCMA 2023 (pp. 259-264). Institute of Electrical and Electronics Engineers Inc..

MLA:

Ockel, Manuela, et al. "Enhancing Flexibility in Power Electronics Production: A Study on Robotic Handling of Copper Clips for Laser Bonding." Proceedings of the 11th International Conference on Control, Mechatronics and Automation, ICCMA 2023 Institute of Electrical and Electronics Engineers Inc., 2023. 259-264.

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