Reliability of lead-free solders for die attach in automotive power modules
Ottinger B, Holverscheid J, Konig S, Jerichow E, Lunz S, Sprenger M, Muller L, Goth C, Franke J (2022)
Publication Type: Conference contribution
Publication year: 2022
Publisher: Institute of Electrical and Electronics Engineers Inc.
Pages Range: 409-413
Conference Proceedings Title: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022
Event location: Singapore
ISBN: 9798350398854
DOI: 10.1109/EPTC56328.2022.10013246
Abstract
Four Sn- based solder joint materials SAC305, SnSb5, SnSb10 and PFDS400® were compared conducting active power cycling tests. In addition, the microstructure before and after the power cycling test was analyzed. Intermetallic compounds were detected at all tested solders after the soldering process. The composition and the amount of intermetallic compound (IMC) phases differed between the solders. The PFDS400® solder joint which consisted mostly of Cu6Sn5 intermetallic compound and an intermediate copper layer showed the highest lifetime followed by SnSb5, SnSb10 and SAC305 solder. While SAC305, SnSb5 and SnSb10 failed due to material fatigue, the PFDS400® solder joint did not show any cracks, damage, or delamination.
Authors with CRIS profile
Bettina Macher
Mario Sprenger
Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)
Mario Sprenger
Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)
Involved external institutions
Germany (DE)How to cite
APA:
Ottinger, B., Holverscheid, J., Konig, S., Jerichow, E., Lunz, S., Sprenger, M.,... Franke, J. (2022). Reliability of lead-free solders for die attach in automotive power modules. In Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 (pp. 409-413). Singapore, SG: Institute of Electrical and Electronics Engineers Inc..
MLA:
Ottinger, Bettina, et al. "Reliability of lead-free solders for die attach in automotive power modules." Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022, Singapore Institute of Electrical and Electronics Engineers Inc., 2022. 409-413.
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