A Highly Integrated EMI Filter Using Polymer Bonded Soft Magnetics as Core Material

Egelkraut S, März M, Rauch M, Schletz A, Frey L (2010)

Publication Language: English

Publication Type: Conference contribution

Publication year: 2010

Event location: Palm Springs US

Authors with CRIS profile

Martin März Lehrstuhl für Leistungselektronik Lothar Frey Lehrstuhl für Elektronische Bauelemente

Involved external institutions

Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB) DE Germany (DE)

How to cite

APA:

Egelkraut, S., März, M., Rauch, M., Schletz, A., & Frey, L. (2010). A Highly Integrated EMI Filter Using Polymer Bonded Soft Magnetics as Core Material. In Proceedings of the IEEE Applied Power Electronics Conference (APEC). Palm Springs, US.

MLA:

Egelkraut, Sven, et al. "A Highly Integrated EMI Filter Using Polymer Bonded Soft Magnetics as Core Material." Proceedings of the IEEE Applied Power Electronics Conference (APEC), Palm Springs 2010.

BibTeX: Download