Novel approach for the implementation of 3D-MID compatible routing functionalities into computer-aided design tools

Zeitler JT, Götze B, Fischer C, Franke J (2014)

Publication Type: Conference contribution

Publication year: 2014

Journal

Advanced Materials Research Trans Tech Publications

Publisher: Trans Tech Publications Ltd

Book Volume: 1038

Pages Range: 11-17

Conference Proceedings Title: Advanced Materials Research

Event location: Nuremberg, Fuerth, POL

ISBN: 9783038352525

DOI: 10.4028/www.scientific.net/AMR.1038.11

Abstract

Molded Interconnect Devices can be considered as attractive option for the integration of electronic functions into mechanical systems. While development methods and procedures reached high standards, CAD tools still drag behind. This paper focusses the necessary software structure for implementing of automated routing algorithms or other MID specific extensions into CAD tools. An innovative three-layer model will be introduced and explained in detail. This paper also describes a method for mapping electrical components on unfolded surfaces for the further implementation of the automated routing algorithms.

Authors with CRIS profile

Jochen Tobias Zeitler Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Christian Fischer Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

Involved external institutions

Gesellschaft zur Förderung angewandter Informatik (GFaI) / Society for the Advancement of Applied Computer Science DE Germany (DE)

How to cite

APA:

Zeitler, J.T., Götze, B., Fischer, C., & Franke, J. (2014). Novel approach for the implementation of 3D-MID compatible routing functionalities into computer-aided design tools. In Jörg Franke, Thomas Kuhn, Andreas Pojtinger, Albert Birkicht (Eds.), Advanced Materials Research (pp. 11-17). Nuremberg, Fuerth, POL: Trans Tech Publications Ltd.

MLA:

Zeitler, Jochen Tobias, et al. "Novel approach for the implementation of 3D-MID compatible routing functionalities into computer-aided design tools." Proceedings of the 11th International Congress Molded Interconnect Devices, MID 2014, Nuremberg, Fuerth, POL Ed. Jörg Franke, Thomas Kuhn, Andreas Pojtinger, Albert Birkicht, Trans Tech Publications Ltd, 2014. 11-17.

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