Mission profile analysis and calorimetric loss measurement of a SiC hybrid module for main inverter application of electric vehicles

Poonjal Pai A, Reiter T, Maerz M (2017)

Publication Type: Conference contribution

Publication year: 2017

Publisher: Institute of Electrical and Electronics Engineers Inc.

Conference Proceedings Title: 2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017

Event location: Delft, NLD

ISBN: 9781509042784

DOI: 10.1109/IWIPP.2017.7936748

Abstract

This paper evaluates the benefits of replacing the Si diodes of a commercial IGBT module for the main inverter application of an electric vehicle with SiC diodes, leaving the other components of the package and the system unchanged. This will give a direct comparison of Si vs SiC diodes, without giving scope for discrepancies arising out of differences in the packaging, gate-driver circuit etc. The IGBT-module chosen for comparison is a low inductance (8nH) HybridPACK Drive module from Infineon, suitable for high speed switching. A loss model is developed for the modules, and the resulting model is used to investigate the performance for various drive cycles (Artemis, WLTP, NEDC). A calorimetric loss measurement setup is developed for experimental verification of the results.

Involved external institutions

Infineon Technologies AG DE Germany (DE) Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB) DE Germany (DE)

How to cite

APA:

Poonjal Pai, A., Reiter, T., & Maerz, M. (2017). Mission profile analysis and calorimetric loss measurement of a SiC hybrid module for main inverter application of electric vehicles. In 2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017. Delft, NLD: Institute of Electrical and Electronics Engineers Inc..

MLA:

Poonjal Pai, Ajay, Tomas Reiter, and Martin Maerz. "Mission profile analysis and calorimetric loss measurement of a SiC hybrid module for main inverter application of electric vehicles." Proceedings of the 2017 IEEE International Workshop on Integrated Power Packaging, IWIPP 2017, Delft, NLD Institute of Electrical and Electronics Engineers Inc., 2017.

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