Seidel R, Leibold F, Thielen N, Franke J (2020)
Publication Language: English
Publication Type: Conference contribution
Publication year: 2020
URI: https://ieeexplore.ieee.org/document/9121028
DOI: 10.1109/ISSE49702.2020.9121028
APA:
Seidel, R., Leibold, F., Thielen, N., & Franke, J. (2020). Prediction of the Solder Rise in Selective Wave Soldering Comparing Decision Tree and Logistic Regression.
MLA:
Seidel, Reinhardt, et al. "Prediction of the Solder Rise in Selective Wave Soldering Comparing Decision Tree and Logistic Regression." 2020.
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