Selective Silver Sintering on Organic-Based Circuit Boards

Müller J, Novak M, Dresel F, Bayer CF, Schletz A, Endres T, März M (2019)

Publication Language: English

Publication Type: Conference contribution, Conference Contribution

Publication year: 2019

Event location: Nürnberg DE

Abstract

Silver sintering on ceramic circuit carriers is in mass production. The sintering on organic-based circuit boards such as standard printed circuit boards (PCB) was developed. The sizes of the dies were 18.5 mm² to 25.75 mm². Thereof the process can be used for device sizes used in power electronics. Shear tests were used to draw conclusions from the bonding strength. The highest shear strength of 16.0 MPa was received for die transfer film (DTF) cut-out temperature 140°C, substrate temperature 180 °C and 150 s sintering time. The PCBs were not damaged during processing.

Authors with CRIS profile

Martin März Lehrstuhl für Leistungselektronik (LEE)

Involved external institutions

Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB) DE Germany (DE)

How to cite

APA:

Müller, J., Novak, M., Dresel, F., Bayer, C.F., Schletz, A., Endres, T., & März, M. (2019). Selective Silver Sintering on Organic-Based Circuit Boards. In Proceedings of the 2019 PCIM Europe. Nürnberg, DE.

MLA:

Müller, Jonas, et al. "Selective Silver Sintering on Organic-Based Circuit Boards." Proceedings of the 2019 PCIM Europe, Nürnberg 2019.

BibTeX: Download