SMA foil-based elastocaloric cooling: From material behavior to device engineering

Bruederlin F, Ossmer H, Wendler F, Miyazaki S, Kohl M (2017)

Publication Status: Published

Publication Type: Journal article, Original article

Publication year: 2017

Journal

Journal of Physics D-Applied Physics Institute of Physics: Hybrid Open Access

Publisher: Institute of Physics Publishing

Book Volume: 50

Article Number: 424003

Journal Issue: 42

DOI: 10.1088/1361-6463/aa87a2

Authors with CRIS profile

Frank Wendler Lehrstuhl für Werkstoffsimulation

Involved external institutions

Karlsruhe Institute of Technology (KIT) DE Germany (DE) University of Tsukuba / 筑波大学 JP Japan (JP)

How to cite

APA:

Bruederlin, F., Ossmer, H., Wendler, F., Miyazaki, S., & Kohl, M. (2017). SMA foil-based elastocaloric cooling: From material behavior to device engineering. Journal of Physics D-Applied Physics, 50(42). https://doi.org/10.1088/1361-6463/aa87a2

MLA:

Bruederlin, F., et al. "SMA foil-based elastocaloric cooling: From material behavior to device engineering." Journal of Physics D-Applied Physics 50.42 (2017).

BibTeX: Download